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What are the adhesive requirements for SMT PCB Assembly surface mount processing?

2025-08-28

The adhesive used in SMT PCBA surface mount processing is mainly used for the wave soldering process of surface mounted components such as chip components, SOT, SOIC, etc. The purpose of fixing surface mounted components on the PCB with glue is to avoid the possibility of component detachment or displacement under the impact of high temperature wave peaks. So what are the requirements for adhesive in SMT surface mount processing?

Requirements for SMT adhesive:
1. The adhesive should have excellent thixotropic properties;
2. No wire drawing, no bubbles;
3. High wet strength, low moisture absorption;
4. The curing temperature of the glue is low and the curing time is short;
5. Have sufficient curing strength;
6. Has good repair characteristics;
7. Packaging. The packaging type should be convenient for the use of the equipment.
8. Non toxicity;
9. The color is easy to identify, making it convenient to check the quality of the adhesive dots;

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